Instrumentation

• Dual FE-SEMs provide high resolution imaging of varied engineered, biological and natural (geological)samples
• Ultra-high resolution at low accelerating voltage to allow nanometer scale imaging 
• Backscatter (BSE) and secondary electron imaging (SEI) and InLens detector
• Energy Dispersive Spectrometry (EDS), large area and fast detector, for elemental analysis and mapping (Oxford Ultim detector)
• Electron back-scatted diffraction (EBSD) for in situ phase identification, crystal structure and crystallographic orientation determinations (Oxford Symmetry system)
• Variable pressure and high vacuum modes available
• Large volume sample analysis chamber
• Cathodoluminescence imaging with spectrometer for mapping trace element distribution (REEs and transition metals), residual strain, and spectroscopic determination of valence state with state-of-the-art Delmic system.
• Cryogenic stage for analysis of biological materials (e.g., biofilms)
• Tensile stage for real-time observation of materials under stress.
• Cryogenic stage for imaging biological tissues and ice

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Zeiss SEMs

Oxford EDS and EBSD detectors

Calthode-luminescence detector

•  Surface compositional analysis for all elements from Li (Z=3) and heavier of atomic monolayers (~1 nm)
•  Quantitative analysis and mapping of surface components
• Sub-micron spatial analysis; enhanced lateral spatial resolution for elemental analysis (<8 nm with a 20kV, 1nA electron beam)
• Advanced charge compensation system allows for analysis of insulating materials
• Limited chemical (valence state) information
• Sputter depth profiling to characterize surficial stratigraphy (three dimensional analysis) using an Ar sputter gun
• EDS detector for “bulk” compositional analysis and mapping; allows for direct comparison of composition of “bulk” material and surficial composition measured by AES.
• EBSD detector for in situ phase identification, crystallographic orientation, and crystallographic preferred orientation and residual strain mapping

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Physical Electronics

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• For surface analysis of atomic monolayers on a 1-10 nm scale
• Mass resolution of around 5,000 m/∆m (~ 0.00x amu) and spatial resolution of ~ 1 µm
• Mass range of 0-10,000 amu
• Depth profiling of chemical stratigraphy of surface layers
• Trace element detection limits in ppm range
• Seamless positive and negative ion imaging modes
• Large sample loading area can accommodate up to 8-inch wafers
• Sub-micron imaging to map any mass number of interest
• Allows retrospective analysis with data cube giving full mass spectrum from every pixel

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ION TOF

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Current Physical Electronics 5600 is not available as of 2022; a new instrument will be procured with NSF MRI funds 2026

• Elemental identification and quantification 

• Chemical functional group identification and quantification 

• Chemical state imaging 

• Surface sensitivity 

• Layer-by-layer depth profiling 

• Minimal sample damage 

• Analysis of insulating and conducting samples 

• Data collection / stage automation 

• Cold stage 

• Imaging of conducting and non-conducting surfaces
• Sub-nanometer resolution
• Imaging in air and liquid, allowing in-situ measurements and real time imaging of biological and chemical processes
• Contact and tapping modes of operation are available; ability to functionalize AFM tips to measure forces of chemical interactions
• AFM can be used to measure and localize many different forces including: adhesion strength, magnetic forces and mechanical properties
• True 3D imaging and measurements
• Magnetic, friction, chemical, and phase imaging

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Oxford

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• Features a unique D8 diffractometer family platform, perfect for all X-ray powder diffraction and scattering application
• Rapid phase identification based on X-ray diffraction patterns 
• Non-destructive analysis of crystalline structures
• Large area X-ray detector produces high resolution XRD spectra; rapid data acquisition over a range of two-theta values
• Simple sample preparation (powder)
• Quantitative analysis of solid mixtures using Rietveld Method
• JADE software used for data reduction and interpretation; phase identification, Rietveld whole pattern fitting for quantitative analysis, unit cell refinement, determination of amorphous content, clay identification
• Standard Bragg-Brentano X-ray optics (convergent beam)
• Parallel beam X-ray optics for Grazing Incident Diffraction (GID; characterization of thin film phases) and X-ray Reflectometry (XRR; measurement of surface layer thickness, density and roughness)

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Bruker

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• Bulk compositional analysis of solids and fluids
• Rapid, non-destructive data collection (~2 minutes)
• All elements from Mg and heavier, with PPM sensitivity for trace elements
• Detection limits of ppm
• Powdered samples are typically used, but other irregularly shaped solids (eg. art and archeology objects) and fluids can also be analyzed;
• Can be used on a platform in the lab or for in situ analysis in field settings.
• Routinely used to analyze rocks/soils; metals; ceramics; screening for toxic metals (Pb, As, Se, Cr, etc); forensic studies (e.g., archeological and art artefacts)

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Thermo Fisher

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• Provides contact angle measurement
• Determines surface energy
• Hydrophilicity/hydrophobicity of surfaces
• Gives information on surface cleanliness, roughness, etc.

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• Provides indirect measure of the net charge on a nanoparticle
• Zeta potential values are determined via electrophoretic mobility measurements
• Obtains zeta potential values of nanoparticles in aqueous solution
• Gives criteria for the tendency of particles to flocculate (aggregate)

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•  Precision objectives including air, oil and water immersion objectives
• Suite of reflected (fluorescent) filters (DAPI, FITC/CY2, TRITC/CY3, triple band and RBF)
• Significantly reduced autofluorescence and signal-to-noise ratio
• DIC imaging (10x, 20x, 40x, 60x)
• Digital camera imaging for still and time-lapse observations

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• High quality desktop vacuum coating systems
• 108 series sputter coaters for standard SEM and  EDS sample coating
• Its dedicated thickness measurement system offers tight controls to create the desired coating thickness
• Better and more uniform coating on topographic samples
• Easy to use

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• For sputter coating samples for SEM prep with metal conductive layer 
• Two coaters: Dual source and dedicated source with interchangeable metal targets 
• Dual source coater can provide alternating metal layers 
• Adjustable current and time settings to give controlled layer thicknesses of 10-20 nm 
• Available targets are iridium, gold, silver, platinum, and gold palladium to different applications 

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•  Alternative to air drying for vacuum samples
• Reduces imaging artifacts 
• Uses liquid CO₂

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